NGK developed its own DCB technology – starting with raw material development (ceramic bare master cards) to the finished substrates. In order to provide the highest level of quality requirements and product performance, our patented DCB substrates are further toughened by adding ZrO2 to the conventional Al2O3 thereby achieving higher ceramic strength and thermal characteristics.

NGK’s Direct Copper Bonded (DCB) substrates are based on both 96%-Al2O3 and ZDA [ZrO2 (10–20%) doped alumina] bare ceramic substrates, directly bonded with copper on both sides – through a single-step bonding process.

NGK’s Active Metal Brazing (AMB) substrates are based on silicon nitride (Si3N4) ceramic. In addition to the existing DCB products, the copper on both sides is bonded using a brazing paste under pressure and vacuum conditions, which achieves an ultra-thin bonding layer for superior thermal-cycle durability and isolation reliability.

NGK will introduce SN-AMB substrates and DCB substrates used as circuit substrates for a power semiconductor module @ PCIM.

For more information, please visit NGK's booth or contact us:

Email: pec-support@ngk-e.de